Vertical GaN power device with breakdown voltage control

ABSTRACT

A method for fabricating a vertical GaN power device includes providing a first GaN material having a first conductivity type and forming a second GaN material having a second conductivity type and coupled to the first GaN material to create a junction. The method further includes implanting ions through the second GaN material and into a first portion of the first GaN material to increase a doping concentration of the first conductivity type. The first portion of the junction is characterized by a reduced breakdown voltage relative to a breakdown voltage of a second portion of the junction.

BACKGROUND OF THE INVENTION

Power electronics are widely used in a variety of applications. Powerelectronic devices are commonly used in circuits to modify the form ofelectrical energy, for example, from ac to dc, from one voltage level toanother, or in some other way. Such devices can operate over a widerange of power levels, from milliwatts in mobile devices to hundreds ofmegawatts in a high voltage power transmission system. Despite theprogress made in power electronics, there is a need in the art forimproved electronics systems and methods of operating the same.

SUMMARY OF THE INVENTION

The present invention relates generally to electronic devices. Morespecifically, the present invention relates to fabricating verticalgallium-nitride (GaN) power devices with one or more controlledbreakdown regions configured to help determine where the breakdowncurrent flows in the vertical GaN power devices. Merely by way ofexample, the invention has been applied to methods and systems formanufacturing vertical diodes, including Schottky barrier diodes, aswell as junction field-effect transistors (JFETs). In fact, the methodsand techniques can be applied to a variety of semiconductor devicesutilizing a p-n junction, or the like.

An example method for fabricating a vertical GaN power device, accordingto the disclosure, can include providing a first GaN material having afirst conductivity type and forming a second GaN material having asecond conductivity type and coupled to the first GaN material to createa junction. The method further includes implanting ions through thesecond GaN material and into a first portion of the first GaN materialto increase a doping concentration of the first conductivity type. Thefirst portion of the junction is characterized by a reduced breakdownvoltage relative to a breakdown voltage of a second portion of thejunction.

An example vertical GaN power device, according to the disclosure, caninclude a first GaN material having a first conductivity type and asecond GaN material having a second conductivity type and coupled to thefirst GaN material to form a junction. A first portion of the junctioncan include an implanted region of the first conductivity type, theimplanted region can have a dopant density higher than a dopant densityof the first GaN material, and the first portion of the junction can becharacterized by a reduced breakdown voltage relative to a breakdownvoltage of a second portion of the junction.

An example vertical III-nitride power device, according to thedisclosure, can include a junction formed by a first GaN material of afirst conductivity type coupled to a second GaN material of a secondconductivity type. The junction can further include a device region anda controlled breakdown region within the device region. The junction inthe controlled breakdown region can be characterized by having a lowerbreakdown voltage than at least a portion of the device region outsideof the controlled breakdown region.

Numerous benefits are achieved by way of the present invention overconventional techniques. For example, the controlled breakdown regioncan include characteristics (size, location, etc.) to reduce oreliminate breakdown current at the edges of the vertical GaN powerdevice. The controlled current flow provided by the controlled breakdownregion can thereby reduce heating of the device and any deterioration inperformance resulting therefrom. These and other embodiments of theinvention, along with many of its advantages and features, are describedin more detail in conjunction with the text below and attached figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1B are simplified cross-sectional diagrams illustrating asemiconductor device, according to one embodiment;

FIGS. 2A-2D are simplified cross-sectional diagrams illustrating aprocess for creating a vertical GaN diode with a controlled breakdownregion, according to one embodiment;

FIGS. 2E-1 and 2E-2 illustrate embodiments of edge terminationstructures that may be used in conjunction with the vertical GaN diodeof FIGS. 2A-2D;

FIGS. 3A and 3B illustrate an embodiment of how a controlled breakdownregion 250 can be utilized with a Schottky barrier diode;

FIGS. 4A and 4B, illustrate an embodiment of how a controlled breakdownregion 250 can be utilized with a JFET 400;

FIG. 5 is simplified flowchart illustrating an embodiment of a method offabricating a vertical GaN power device.

In the appended figures, similar components and/or features may have thesame reference label. Further, various components of the same type maybe distinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. If only the firstreference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

The present invention relates generally to electronic devices. Morespecifically, the present invention relates to providing a voltagebreakdown control to help ensure controlled breakdown of a p-n junctionin a vertical gallium-nitride (GaN) device. This can, for instance, helpensure that a device region of a vertical GaN device breaks down at acontrolled region within a portion of the device region, rather than atthe edges of the device region. Merely by way of example, the inventionhas been applied to techniques for manufacturing vertical diodes,including Schottky barrier diodes. The methods and techniques can alsobe applied to junction field-effect transistors (JFETs) and othersemiconductor devices utilizing p-n junctions.

GaN-based electronic and optoelectronic devices are undergoing rapiddevelopment. Desirable properties associated with GaN and related alloysand heterostructures include high bandgap energy for visible andultraviolet light emission, favorable transport properties (e.g., highelectron mobility and saturation velocity), a high breakdown field, andhigh thermal conductivity. According to embodiments of the presentinvention, gallium nitride (GaN) epitaxy on pseudo-bulk GaN substratesis utilized to fabricate vertical GaN-based semiconductor devices notpossible using conventional techniques. For example, conventionalmethods of growing GaN include using a foreign substrate such as siliconcarbide (SiC). This can limit the thickness of a usable GaN layer grownon the foreign substrate due to differences in thermal expansioncoefficients and lattice constant between the GaN layer and the foreignsubstrate. High defect densities at the interface between GaN and theforeign substrate further complicate attempts to create verticaldevices, including power electronic devices such as JFETs and otherfield-effect transistors.

Homoepitaxial GaN layers on bulk GaN substrates, on the other hand, areutilized in the embodiments described herein to provide superiorproperties to conventional techniques and devices. For instance,electron mobility, μ, is higher for a given background doping level, N.This provides low resistivity, ρ, because resistivity is inverselyproportional to electron mobility, as provided by equation (1):

$\begin{matrix}{{\rho = \frac{1}{q\;\mu\; N}},} & (1)\end{matrix}$where q is the elementary charge.

Another superior property provided by homoepitaxial GaN layers on bulkGaN substrates is high critical electric field for avalanche breakdown.A high critical electric field allows a larger voltage to be supportedover smaller length, L, than a material with a lower critical electricfield. A smaller length for current to flow together with lowresistivity give rise to a lower resistance, R, than other materials,since resistance can be determined by the equation:

$\begin{matrix}{{R = \frac{\rho\; L}{A}},} & (2)\end{matrix}$where A is the cross-sectional area of the channel or current path.

In general, a tradeoff exists between the physical dimension of a deviceneeded to support high voltage in a device's off-state and the abilityto pass current through the same device with low resistance in theon-state. In many cases GaN is preferable over other materials inminimizing this tradeoff and maximizing performance. In addition, GaNlayers grown on bulk GaN substrates have low defect density compared tolayers grown on mismatched substrates. The low defect density will giverise to superior thermal conductivity, less trap-related effects such asdynamic on-resistance, and better reliability.

According to embodiments of the present invention, gallium nitride (GaN)epitaxy on pseudo-bulk GaN substrates can be utilized to fabricate edgesemiconductor devices and/or edge termination structures not possibleusing conventional techniques. For example, conventional methods ofgrowing GaN include using a foreign substrate such as silicon carbide(SiC). This can limit the thickness of a usable GaN layer grown on theforeign substrate due to differences in thermal expansion coefficientsand lattice constant between the GaN layer and the foreign substrate.High defect densities at the interface between GaN and the foreignsubstrate further complicate attempts to create edge terminationstructures for various types of semiconductor devices.

Semiconductor devices utilizing edge termination structures are able toexploit the high critical electric field provided by GaN and relatedalloys and heterostructures. Edge termination techniques such as fieldplates, guard rings, and other structures located at and/or near an edgeof a p-n junction provide proper edge termination by alleviating highfields at the edge of the semiconductor device. When properly employed,edge termination can help a semiconductor device to break down moreuniformly at its main junction rather than uncontrollably at its edge.

Despite edge termination techniques, however, field crowding can stilloccur at the edge of a device such that breakdown occurs at the edge ofthe device at a voltage lower than the ideal parallel plane breakdownvoltage. Breakdown at the edge of the device can limit the area throughwhich current flows, heating up the device. Techniques disclosed hereinemploy a controlled breakdown region, which can help ensure avalanchebreakdown occurs at the main junction of the device, additionally oralternatively to avalanche breakdown at the edge of the device. This canhelp ensure the overall break down of the semiconductor device occurseven more uniformly than with edge termination structures alone. Thatsaid, techniques disclosed herein do not necessarily need to be used inconjunction with edge termination structures.

FIGS. 1A-1B are simplified cross-sectional diagrams of a portion of asemiconductor device, according to one embodiment, illustrating how acontrolled breakdown region provided herein (which can be used with edgetermination structures) can be used to improve the semiconductordevice's performance using edge termination. FIG. 1A illustrates a diodestructure where a p-n junction is formed by coupling a p-typesemiconductor layer 20 on an n-type semiconductor substrate 10, whichcan be an epitaxial layer. In this example, a metal layer 30 is alsoformed on the p-type semiconductor layer 20 to provide electricalconnectivity to the diode. Metal layer 30 may or may not share the sameedge as layer 20 in FIG. 1A and FIG. 1B.

Because the diode of FIG. 1A has no termination structures, itsperformance is reduced. The electric field 40 (represented in FIG. 1A aspotential lines), is crowded near the edge 50 of the diode, causingbreakdown at a voltage that can be much less than the parallel planebreakdown voltage for the diode. This phenomenon can be especiallydetrimental to the operation of high-voltage semiconductor devices.

FIG. 1B illustrates how edge termination structures 60 can be used toalleviate field crowding near the edge 50 of the diode. The edgetermination structures 60, which can be made of the same p-typesemiconductor material as the p-type semiconductor layer 20 of thediode, are placed near the diode and given voltages such that theelectric field 40 extends laterally beyond the edge 50 of the diode. Forinstance, voltages can be reduced for each edge termination structure 60as distance from the edge 50 of the diode increases (e.g., a voltage ona closer edge termination structure 60-1 is higher than a voltage on afarther termination structure 60-2), ensuring an outermost edge 80 of anoutermost edge termination structure 60-2 has sufficiently low voltagesuch that the electric field at its edge is lower than the peak field atthe semiconductor's main junction can help ensure the semiconductordevice operates more closely to its parallel plane breakdown voltage.

The use of edge termination structures, however, typically cannot enablethe semiconductor device to operate 100% of its parallel plane breakdownvoltage. Furthermore, the device will continue to break down at itsedges, resulting in the breakdown current flowing through only a smallportion of the p-n junction near the p-n junction's periphery. Thisbreakdown current flow through a relatively limited area can heat up thesemiconductor device, which can damage, degrade, or even destroy thesemiconductor device. At a minimum, the current flow at the edges of thesemiconductor device can limit the amount of current flow the device iscapable of conducting.

Techniques provided herein utilize a controlled breakdown region 90 tohelp spread the breakdown into the main device junction. The controlledbreakdown region 90 can comprise a specially-doped area of the maindevice junction having a breakdown voltage lower than other portions ofthe main device junction to help ensure the breakdown at the controlledbreakdown region 90 occurs at or before breakdown at the edges of thesemiconductor device. This allows breakdown current to flow through themain device junction.

FIGS. 2A-2D are simplified cross-sectional diagrams illustrating aprocess for creating a vertical GaN diode with a controlled breakdownregion, according to one embodiment. Referring to FIG. 1, a first GaNlayer 210 is formed on a GaN substrate 200. As indicated above, the GaNsubstrate 200 can be a pseudo-bulk GaN material on which the first GaNlayer 210 is grown. Dopant concentrations (e.g., doping density) of theGaN substrate 200 can vary. For example, a GaN substrate 200 can have ann+ conductivity type, with dopant concentrations ranging from 1×10¹⁷cm⁻³ to 1×10¹⁹ cm⁻³. Although the GaN substrate 200 is illustrated asincluding a single material composition, multiple layers can be providedas part of the substrate. Moreover, adhesion, buffer, and other layers(not illustrated) can be utilized during the epitaxial growth process.One of ordinary skill in the art would recognize many variations,modifications, and alternatives.

The properties of the first GaN layer 210 can also vary, depending ondesired functionality. The first GaN layer 210 can serve as a driftregion for the vertical GaN diode, and therefore can be a relativelylow-doped material. In some embodiments, the dopant concentration of thefirst GaN layer 210 is lower than the dopant concentration of the GaNsubstrate 200. For example, the first GaN layer 210 can have an n−conductivity type, with dopant concentrations between about 1×10¹⁴ cm⁻³to 1×10¹⁸ cm⁻³. Furthermore, the dopant concentration can be uniform, orcan vary, for example, as a function of the thickness of the driftregion. In some embodiments, the first GaN layer 210 can comprise two ormore sublayers, which can have differing physical characteristics (e.g.,dopant concentrations, dopant uniformity, etc.)

The thickness 215 of the first GaN layer 210 can also varysubstantially, depending on the desired functionality. As discussedabove, homoepitaxial growth can enable the first GaN layer 210 to begrown far thicker than layers formed using conventional methods. Ingeneral, in some embodiments, the thickness 215 can be between 0.5 μmand 100 μm, for example. In other embodiments thicknesses 215 aregreater than 5 μm. Resulting breakdown voltages for the vertical GaNdiode, after applying the techniques disclosed herein, can varydepending on the embodiment. Some embodiments provide for breakdownvoltages of at least 100V, 300V, 600V, 1.2 kV, 1.7 kV, 3.3 kV, 5.5 kV,13 kV, or 20 kV.

Different dopants can be used to create n- and p-type GaN layers andstructures disclosed herein. For example, n-type dopants can includesilicon, germanium, oxygen, or the like. P-type dopants can includemagnesium, beryllium, zinc, or the like.

FIG. 2B illustrates the formation of a second GaN layer 220 coupled tothe first GaN layer 210. The second GaN layer 220 has a conductivitytype different than the first GaN layer 210, and therefore forms a p-njunction with the first GaN layer 210. For instance, if the first GaNlayer 210 is formed from an n-type GaN material, the second GaN layer220 will be formed from a p-type GaN material, and vice versa. In someembodiments, the second GaN layer 220 can also be used to form the edgetermination structures. In such embodiments, the second GaN layer 220can be a selective regrowth over portions of the first GaN layer 210,with other portions of the structure, characterized by reduced or nogrowth as a result of the presence of a regrowth mask (not shown). Oneof ordinary skill in the art would recognize many variations,modifications, and alternatives.

The thickness 225 of the second GaN layer 220 can vary, depending on theprocess used to form the layer and the device design. In someembodiments, the thickness 225 of the second GaN layer 220 is between0.1 μm and 5 μm. In other embodiments, the thickness 225 of the secondGaN layer 220 is between 0.3 μm and 1 μm.

The second GaN layer 220 can be relatively highly doped, for example ina range from about 5×10¹⁷ cm⁻³ to about 1×10¹⁹ cm⁻³. Additionally, aswith other epitaxial layers, the dopant concentration of the second GaNlayer 220 can be uniform or non-uniform as a function of thickness. Insome embodiments, the dopant concentration increases with thickness,such that the dopant concentration is relatively low near the first GaNlayer 210 and increases as the distance from the first GaN layer 210increases. Such embodiments provide higher dopant concentrations at thetop of the second GaN layer 220 where metal contacts can be subsequentlyformed. Other embodiments utilize heavily doped contact layers (notshown) to form Ohmic contacts.

One method of forming the layers described herein can be through aregrowth process that uses an in-situ etch and diffusion preparationprocesses. These preparation processes are described in U.S. patentapplication Ser. No. 13/198,666, filed Aug. 4, 2011, entitled “Methodand System for Formation of P-N Junctions in Gallium Nitride BasedElectronics,” the entirety of which is hereby incorporated by reference.

FIGS. 2C-2D illustrate the formation of a controlled breakdown region250, lowering the breakdown voltage at a portion of the junction betweenthe first GaN layer 210 and the second GaN layer 220. Referring to FIG.2C, the controlled breakdown region 250 is defined by a mask 230, whichblocks portions of the surface where the implant is not desired and hasone or more openings 240 where the implant is allowed to pass. The maskmay consist of photoresist, dielectric layers such as silicon oxide orsilicon nitride metals such as Ni or Cr, or other materials, forexample, or some combination thereof. The mask can be patterned usingconventional methods to expose areas in which a controlled breakdownregion 250 is desired. The mask can expose a portion of the p-n junctionof the semiconductor device, for example, while covering edgetermination regions and/or certain device regions. Although only onecontrolled breakdown region 250 is shown in the embodiment of FIGS.2C-2D, a plurality of controlled breakdown regions 250 may be formed.

Referring to FIG. 2D, ion implantation is performed. Where the first GaNlayer 210 has n-type conductivity, an n-type dopant, such as Si, isintroduced into the GaN by ion implantation through the second GaN layer220. In this process, the entire wafer surface is bombarded by Si ions260, for example, accelerated at predetermined energies to achievecontrolled doping depths and densities. The resulting n-type dopingdensity at the p-n junction is higher than the background n-type dopingof GaN layer 210. If the p-type doping of GaN layer 220 is substantiallyhigher than the n-type doping of GaN layer 210, then the breakdownvoltage of the p-n junction formed by these layers is determined mostlyby the n-type doping of GaN layer 210. Thus, the additional n-typedoping density introduced by Si implant 260 primarily determines thebreakdown voltage of the controlled breakdown region 250. In anembodiment where the thickness 225 of the second GaN layer 220 isapproximately 0.4 microns, the implantation energy can be approximately400 keV. Other embodiments can utilize one or more implantation energiesfrom 200 keV to 600 keV. Some embodiments can include implantationenergies outside this range, depending on the thickness 225 of thesecond GaN layer 220, and/or other factors. Some embodiments may utilizeadditional or alternative doping processes. One of ordinary skill in theart would recognize many variations, modifications, and alternatives.

After Si ions are implanted into GaN layers 220 and 210, they can beannealed using a high temperature step to activate the implanted ions(i.e. allow the ions to interact with the GaN lattice such that theybecome electrically active). For example, the GaN substrate may besubjected to a high-temperature anneal using rapid thermal annealing(RTA), and furnace tube, or in an MOCVD reactor. Anneal temperatures inthe range of 1000 C to 1200 C may be used, and the duration of theanneal may be from a few minutes to several hours. To mitigate possibledecomposition of the GaN surface during the high temperature anneal, theanneal may be carried out in an ammonia-rich environment. Alternatively,or in addition, a cap layer may be formed on the GaN surface prior tothe anneal. For example, a thin layer of aluminum nitride,aluminum-gallium nitride, silicon nitride, or similar films may beformed by MOCVD deposition prior to the Si implantation, the Si ions maybe implanted through this cap layer and into GaN layers 220 and 210, andthe cap layer may remain on the GaN surface during the activation annealto stabilize the GaN surface and prevent decomposition.

The breakdown voltage of controlled breakdown region 250 can be set tohelp ensure breakdown occurs at the controlled breakdown region 250 ator before breakdown occurs at edges of the semiconductor device. Forexample, if a semiconductor device is expected to break down atapproximately 90% of the parallel plane breakdown voltage, thecontrolled breakdown region 250 can be set at 80% of the parallel planebreakdown voltage. This would help ensure that breakdown current will,at least initially, flow through the controlled breakdown region 250rather than at the edges. As voltage increases, breakdown current mayflow at the edges and/or other locations of the semiconductor device.However, because doping of the controlled breakdown region 250 can setthe breakdown voltage of the controlled breakdown region 250 accurately,breakdown of the semiconductor devices occurs in a more predictablemanner than it would have if the semiconductor device had no controlledbreakdown region 250.

FIGS. 2E-1 and 2E-2 illustrate embodiments of edge terminationstructures that may be used in conjunction with the vertical GaN diodeof FIGS. 2A-2D.

FIG. 2E-1 illustrates the formation of a junction termination region280. In the embodiment shown, conductivity of the second GaN layer 220and/or the first GaN layer 210 can be modified using an ion implantationprocess to create an edge termination region 270 in which theconductivity with respect to the unimplanted state is reduced. Theconductivity of each of the first and second GaN layers 210, 220 isbased, in part, on the active dopants or charge in the epitaxial layertimes the thickness of the layer (i.e., the integrated charge in thelayer). Ion implantation processes can be used to implant ionic speciessuch as argon, nitrogen, helium, hydrogen and/or other appropriatespecies to increase the resistivity (i.e., decrease the conductivity) ofpredetermined portions of the epitaxial layer(s) to provide a spatialvariation or modulation in the conductivity. Without limitingembodiments of the present invention, the inventors believe that theimplantation process reduces the conductivity by at least one of thefollowing mechanisms: compensating for dopants, annihilating dopants,increasing vacancy density, increasing void density, decreasing thetotal net charge in the epitaxial layer, decreasing the density ofionized acceptors (donors for n-type material), some or all of which mayprovide for increased resistivity. Due to the robust nature of GaN-basedmaterials, ion implantation can produce implanted ions interspersed withunchanged epitaxial material, effectively reducing the conductivity inan averaged sense, with voids or vacancies interspersed in the latticewith as-grown epitaxial material. Embodiments are not limited by thephysical mechanism resulting in the spatial conductivity modulation.

The lateral conductivity profile is a predetermined profile enablingdevice designers to achieve a breakdown at the edges of thesemiconductor device much closer to the parallel plane breakdown voltagethan otherwise achievable. Independent of the physical mechanism, a setof junction termination elements 285 can be characterized by differingactive dopant densities or concentrations, with the outer junctiontermination elements having a lower active dopant density than innerjunction termination elements. In some embodiments, an outermostjunction termination element 285-1 can be an isolation elementcharacterized by high resistivity and can be fabricated by ionimplantation, etching, combinations thereof, or the like.

The widths 287 of the various junction termination elements 285 of thejunction termination region 280 can also vary. According one embodiment,the width of the junction termination elements 285 of the junctiontermination region 280 range from 2 μm to 30 μm and can be approximatelythe same for all junction termination elements 285 of the junctiontermination region 280. In other embodiments, the widths vary amongjunction termination elements 285. In one embodiment, the depth anddoping concentration associated with the junction termination elements285 of the junction termination region 280 can also vary, which can bemodulated by ion implantation energy and dose.

As an example, the implantation dose can vary between junctiontermination elements 285, thereby varying the conductivity of theelements. Additionally, in embodiments in which the implantation processis used as an alternative to an etch-based process, epitaxially grownsurfaces are preserved, providing passivation benefits.

In another embodiment, the junction termination elements 285 withvarying conductivity can be fabricated using one or multiple reducedcharge layers, for example, with thicknesses varying from about 0.01 μmto about 5 μm. In another embodiment, spaces may be formed betweenjunction termination elements 285, with the width between the elementsincreasing with distance from the semiconductor device, ranging, forexample, from about 0.3 μm to about 6 μm. In other embodiments, otherspacings are utilized as appropriate to the particular application.

Additionally or alternatively to junction termination elements 285,embodiments may include an junction termination region 280 with guardrings 288 that circumscribe all or a portion of a main device junctionof the semiconductor device, as shown in FIG. 2E-2. The number of guardrings 288, as well as their spacing and voltage bias, can vary.Embodiments may, for example, include one to seven or more guard rings.

The number of guard rings 288 also can impact voltages at which eachtermination structure is biased. The voltage for each guard ring 288 canbe decreased with each successive termination structure such that thetermination structure farthest from the semiconductor device has thelowest voltage. For example, if the second GaN layer 220 is biased at600V and two guard rings are used, an inner guard ring 288-1 can floatto 400V, and an outer guard ring 288-2 can float to and 200V. Of course,voltages can vary, depending on the physical dimensions andconfiguration of the semiconductor device and guard rings 288.

The spaces between the guard rings 288 can vary. According to someembodiments, width 283 of the spaces between edge guard rings 288 canincrease as the distance from the semiconductor device increases. Forexample, as shown in the embodiment of FIG. 2E-2, the width 283-1 of aspace between the inner guard ring 288-1 and the semiconductor devicecan be smaller than the width 283-2 of a space between the outer guardring 288-1 and the inner guard ring 288-1. The width 283 of the spacescan vary depending on application. According one embodiment, the widthof guard rings 288, ranging from 1 μm to 5 μm, can be approximately thesame for all edge guard rings 288, and the widths 283 of spaces betweenedge guard rings 288 increases with increased distance from thesemiconductor device, ranging anywhere from 0.5 μm to 6 μm. In otherembodiments, other spacings are utilized as appropriate to theparticular application.

Mesa etching, field plates, a junction-termination extension (JTE)region, deep trench termination, and/or a combination of these or otheredge termination mechanisms can be utilized in addition or as analternative to the edge-termination techniques discussed above inrelation to FIGS. 2E-1 and 2E-2. Edge termination techniques aredescribed in more detail in the following commonly assigned U.S. Patentapplications, which are incorporated by reference herein in theirentirety:

-   -   U.S. patent application Ser. No. 13/305,165, filed Nov. 21,        2011, entitled “Edge Termination By Ion Implantation in GaN,”    -   U.S. patent application Ser. No. 13/270,606, filed Oct. 11,        2011, entitled “Method and System for Floating Guard Rings in        GaN Materials,”    -   U.S. patent application Ser. No. 13/299,254, filed Nov. 17,        2011, entitled “Method and System for Fabricating Floating Guard        Rings in GaN Materials,” and    -   U.S. patent application Ser. No. 13/334,742, filed Dec. 22,        2011, entitled “Method and System for Junction Termination in        GaN Materials using Conductivity Modulation.”

The process shown in FIGS. 2A-2E are provided as an example only, andare not limiting. Furthermore, the figures are not drawn to scale, andthe manufacture of the diode can include additional steps and/orfeatures that are not shown. For example, an Ohmic metal contact may becreated on the bottom of GaN substrate 200 to serve as an electricalcontact to the cathode of the diode. The layers and/or structuresdescribed herein may include a number of sublayers, substructures,and/or other components to provide the functionality described herein.One of ordinary skill in the art would recognize many variations,modifications, and alternatives.

A controlled breakdown region 250 described in relation to FIGS. 2A-2Dmay be utilized in a variety of semiconductor devices utilizing a p-njunction.

FIGS. 3A and 3B show how a controlled breakdown region 250 can beutilized with a Schottky barrier diode, according to one embodiment.FIG. 3A is an overhead view of the Schottky barrier diode, and FIG. 3Billustrates a corresponding cross-sectional view at a cross section 390.In this embodiment, the Schottky barrier diode includes a GaN substrate200, first GaN layer 210, second GaN layer 220, and an edge terminationregion 270, which can include similar characteristics to correspondingstructures previously described in relation to other embodiments.

As illustrated, a junction formed by the first GaN layer 210 and thesecond GaN layer 220 circumscribes a Schottky metal structure 320, whichis coupled to the first GaN layer 210 and the second GaN layer 220. TheSchottky metal structure 320 can comprise one or more layers of metaland/or alloys to create a Schottky barrier with the first GaN layer 210.The Schottky metal structure 320 further can be formed using a varietyof techniques, including lift-off and/or deposition with subsequentetching, which can vary depending on the metals used. In someembodiments, a first layer of the Schottky metal structure 320 caninclude nickel, platinum, palladium, to make a good Schottky barrierwith the P-type GaN layer 210, and additional layers of the Schottkymetal structure 320 may be formed on top of the first layer to providebetter contact. For example, layers of Ti, Ni, Pt, Al, Cu, Ag, Au,and/or other suitable metals may be used.

A portion of the junction formed by the first GaN layer 210 and thesecond GaN layer 220 includes the controlled breakdown region 250, whichcan also circumscribe the Schottky metal structure 320 (as shown in FIG.3A). The controlled breakdown region 250 can improve the function of theSchottky barrier diode by helping ensure that breakdown occurs at thecontrolled breakdown region 250, rather than occurring under Schottkymetal 320 or edge termination region 270. Thus controlled breakdownregion 250 can provide a safe path for avalanche breakdown current toflow through the Schottky diode.

A metallic contact layer 310 can also be formed on a lower surface ofthe GaN substrate 200. The metallic contact layer 310 can be one or morelayers of metal that serve as an Ohmic contact for the cathode of theSchottky diode. For example, the metallic contact layer 310 can comprisea titanium-aluminum (Ti/Al) Ohmic metal. Other metals and/or alloys canbe used including, but not limited to, indium, gallium, aluminum,nickel, gold, silver, combinations thereof, or the like. In someembodiments, an outermost metal of the metallic contact layer 310 caninclude gold, silver, or aluminum, combinations thereof, and the like.The metallic contact layer 310 can be formed using any of a variety ofmethods such as sputtering, evaporation, or the like.

FIGS. 4A and 4B, show how a controlled breakdown region 250 can beutilized with a JFET 400, according to one embodiment. FIG. 4A is anoverhead view of the JFET, and FIG. 4B illustrates a correspondingcross-sectional view at a cross section 490. In this embodiment, theJFET 400 includes a GaN substrate 200, first GaN layer 210, second GaNlayer 220, and edge termination region 270, which can include similarcharacteristics to corresponding structures previously described inrelation to other embodiments.

In the JFET 400, the second GaN layer 220 can form gate regions, whichcan be coupled to and completely surround each of one or more channelregions 406. As with GaN layers of other embodiments described herein,the dopant concentration of the second GaN layer 220 can be uniform ornon-uniform as a function of thickness.

As illustrated in FIG. 4A, the gate region formed by the second GaNlayer 220 can include a continuous region and one or more finger-likeprojections. The gate electrode 412 is disposed over the continuousregion and coupled to the gate region via gate contacts 420. In someembodiments, the gate electrode 412 can include metals such as nickel,platinum, palladium, silver, gold, copper, etc., and alloys thereof. Insome embodiments, the gate electrode 412 can be a multi-layeredstructure (e.g. a metal stack) comprising, for example, an adhesionlayer such as titanium in contact with a relatively thick top metallayer, such as aluminum, gold, silver, or copper, which is suitable forattaching the gate electrode to a semiconductor package.

The first GaN layer 210 can be patterned and etched to form one or morechannel regions 406. The channel region 406 can have a height of between0.5 μm and 5 μm, a width of between 0.5 μm and 5 μm, and an n-typeconductivity with a dopant concentration that is the same as or lowerthan the dopant concentration of the first GaN layer 210. Source regions405 can be disposed on the top of channel regions 406. The sourceregions 405 may have the same conductivity type (e.g. n-type) as thechannel regions 406 and the GaN substrate 200. The doping concentrationof the source regions 405 may be substantially higher than the dopingconcentration of channel regions 406 in order to form a better Ohmiccontact.

A source electrode 440 is coupled to the source regions 405 via sourcecontacts 416. In some embodiments, the source electrode 440 can includemetals such as titanium, aluminum, nickel, gold, etc. and alloysthereof. In some embodiments, the source electrode 440 can be amulti-layered structure comprising, for example, an contact layer suchas titanium that provides a low-resistance Ohmic contact to sourceregions 405 and a relatively thick top metal layer, such as aluminum,gold, silver, or copper, which is suitable for attaching the sourceelectrode to a semiconductor package.

An interlayer dielectric (ILD) layer 460 can be disposed over the secondGaN layer 220 and/or edge termination region 270. One or more gatecontacts 420 can be formed in the interlayer dielectric layer 460 toprovide electrical connection between the second GaN layer 220 and thegate electrode 412. Likewise, one or more source contacts 416 can beformed in the interlayer dielectric layer 460 to provide electricalconnection between the source regions 405 and the source electrode 440.The gate electrode 412 and source electrode 440 can be located such thatthe edge termination region 270 completely surrounds the gate electrode412, thereby isolating the gate electrode 412 from the high voltagepresent on the portion of the first GaN layer 210 that lies outside ofthe edge termination region. Connections to external systems can be madevia electrodes 440 and 412 using wire bonding, soldering, sintering, orother techniques. Additional or alternative edge termination techniquesother than the edge termination region 270, such as those discussedpreviously in relation to other embodiments, may be used.

A drain electrode 450 can be coupled to an opposing surface of GaNsubstrate 200. In one embodiment, drain electrode 450 can be formed fromindium, gallium, titanium, aluminum, nickel, gold, and/or similarmaterials to provide an Ohmic contact to GaN substrate 200. The drainelectrode can be formed using any of a variety of methods such assputtering, evaporation, or the like.

A portion of the junction formed by the first GaN layer 210 and thesecond GaN layer 220 can include a controlled breakdown region 250,which can also circumscribe the channel regions 406 (as shown in FIG.4A). The controlled breakdown region 250 can improve the function of theJFET 100 by insuring that breakdown occurs at the controlled breakdownregion 250, rather than occurring in channel regions 406 or edgetermination region 270. Thus controlled breakdown region 250 provides asafe path for avalanche breakdown current to flow through the JFET.

Other features of the JFET 400 are described in relation tocommonly-assigned U.S. patent application Ser. No. 13/675,694, filedNov. 13, 2012, entitled “Vertical GaN JFET with Low Gate-DrainCapacitance and High Gate-Source Capacitance,” which is herebyincorporated by reference herein in its entirety.

FIG. 5 is simplified flowchart illustrating an example method offabricating a vertical GaN power device, such as the diode, Schottybarrier diode, and/or the FET described in previous embodiments. Themethod can include providing a first GaN material having a firstconductivity type and a first doping density (510). The first GaNmaterial can comprise a first GaN layer provided on a GaN substrate withthe same conductivity type. In some embodiments, for example, the firstGaN material is an n-type GaN layer coupled to an n-type GaN substrate.

The method further includes forming a second GaN material having asecond conductivity type coupled to the first GaN material to create ajunction with a first breakdown voltage that is substantially determinedby the doping density of the first GaN material (520).

The method further includes implanting ions through the second GaNmaterial and into portions of the first GaN material, near the junction,such that these portions of the junction are characterized by a secondbreakdown voltage lower than to the first breakdown voltage (530). Insome embodiments, for example, the junction is a p-n junction formed byan n-type first GaN material coupled to a p-type second GaN material.The portions of the junction characterized by a reduced breakdownvoltage can be a controlled breakdown region as described above.

The difference in breakdown voltages can be due to differences in dopingdensity of the first GaN material. For example, the first portion of thejunction can be formed such that a first dopant concentration of thefirst GaN material forming the first portion of the junction is higherthan a second dopant concentration of the first GaN material forming thesecond portion of the junction. For embodiments in which the first GaNmaterial comprises n-type GaN, the first portion of the junction can beimplanted with silicon and/or other n-type dopants. The first portion ofthe junction can form part of a device region, separate from an edgetermination region. Even so, the vertical GaN power device canoptionally include one or more edge termination structures.

It should be appreciated that the specific steps illustrated in FIG. 5provide a particular method of fabricating a fabricating a vertical GaNpower device according to an embodiment of the present invention. Othersequences of steps may also be performed according to alternativeembodiments. For example, alternative embodiments of the presentinvention may perform the steps outlined above in a different order.Moreover, the individual steps illustrated in FIG. 5 may includemultiple sub-steps that may be performed in various sequences asappropriate to the individual step. Furthermore, additional steps may beadded or removed depending on the particular applications. For example,some embodiments may provide for forming one or more edge terminationstructures by, for example, implanting ions into one or more GaNmaterials or structures. One of ordinary skill in the art wouldrecognize many variations, modifications, and alternatives.

Furthermore, although embodiments provided above are discussed in termsof GaN substrates and GaN epitaxial layers, the present invention is notlimited to these particular binary III-V materials and is applicable toa broader class of III-V materials, in particular III-nitride materials.Additionally, although a GaN substrate is illustrated in FIGS. 2A-2E,embodiments of the present invention are not limited to GaN substrates.Other III-V materials, in particular, III-nitride materials, areincluded within the scope of the present invention and can besubstituted not only for the illustrated GaN substrate, but also forother GaN-based layers and structures described herein. As examples,binary III-V (e.g., III-nitride) materials, ternary III-V (e.g.,III-nitride) materials such as InGaN and AlGaN, quaternary III-nitridematerials, such as AlInGaN, doped versions of these materials, and thelike are included within the scope of the present invention.

Additionally, although embodiments provided describe an n-type driftlayer (e.g., first GaN layer 210) that can be grown on top of an n-typesubstrate, present invention is not limited to this particularconfiguration. In other embodiments, substrates with p-type doping canbe utilized. Additionally, embodiments can use materials having anopposite conductivity type to provide devices with differentfunctionality. Thus, although some embodiments described herein includen-type GaN epitaxial layer(s) doped with silicon, in other embodimentshighly or lightly doped material, p-type material, material doped withdopants in addition to or other than silicon such as Mg, Ca, Be, Ge, Se,S, O, Te, and the like can also be used. The substrates discussed hereincan include a single material system or multiple material systemsincluding composite structures of multiple layers. One of ordinary skillin the art would recognize many variations, modifications, andalternatives.

It is also understood that the examples and embodiments described hereinare for illustrative purposes only and that various modifications orchanges in light thereof will be suggested to persons skilled in the artand are to be included within the spirit and purview of this applicationand scope of the appended claims.

What is claimed is:
 1. A vertical GaN power device comprising: a firstGaN material having a first conductivity type; a second GaN materialhaving a second conductivity type and coupled to the first GaN materialto form a p-n junction; and an implanted region extending from withinthe first GaN material across the p-n junction into the second GaNmaterial, wherein the implanted region spans a first portion of the p-njunction, such that the p-n junction extends from within the implantedregion across a boundary of the implanted region into a second portionof the p-n junction, wherein the first portion of the p-n junction has abreakdown voltage which is less than a breakdown voltage of the secondportion of the p-n junction.
 2. The device of claim 1 the second portionof the junction is disposed between an edge of the junction and thefirst portion of the junction.
 3. The device of claim 1 wherein thefirst conductivity type comprises an n-type conductivity.
 4. The deviceof claim 3 wherein the implanted region comprises silicon.
 5. The deviceof claim 1 wherein the first portion of the junction forms part of adevice region.
 6. The device of claim 1 wherein the device comprises adiode.
 7. The device of claim 6 wherein the diode comprises a Schottkybarrier diode.
 8. The device of claim 1 further comprising one or moreedge termination structures.
 9. A vertical III-nitride power devicecomprising: a p-n junction formed by a first GaN material of a firstconductivity type coupled to a second GaN material of a secondconductivity type, wherein the junction further includes: a deviceregion; and a controlled breakdown region within the device region,wherein the controlled breakdown region extends from within the firstGaN material across a boundary between the first and second GaNmaterials into the second GaN material, wherein the controlled breakdownregion spans a first portion of the junction in the device region, suchthat the junction extends from within the controlled breakdown regionacross a boundary of the controlled breakdown region into a secondportion of the junction, and wherein the junction in the controlledbreakdown region is characterized by having a lower breakdown voltagethan at least a portion of the device region outside of the controlledbreakdown region.
 10. The device of claim 9 further comprising anedge-termination region adjacent to the device region and having one ormore edge-termination structures.
 11. The device of claim 9 wherein afirst dopant concentration of the first GaN material in the controlledbreakdown region is higher than a second dopant concentration of thefirst GaN material in the portion of the device region outside of thecontrolled breakdown region.